Conductive paste, method for forming an interconnection and electrical device
AssigneesNanyang Technological University, Lockheed Martin Corporation
InventorsByung Hoon Lee, Chee Lip Gan, Mei Zhen Ng, Alfred A. Zinn
Life of this patent
Estimating the term…
Abstract
According to embodiments of the present invention, a conductive paste is provided. The conductive paste has a cam-position including a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between about 10:1 and about 50:1. According to further embodiments of the present invention, a method for forming an interconnection and an electrical device are also provided.
Claims28
A conductive paste having a composition comprising a plurality of conductive nanoparticles and a plurality of conductive nanowires, wherein a weight ratio of the plurality of conductive nanoparticles to the plurality of conductive nanowires is between 10:1 and 50:1.
-3. (canceled)
(canceled)
(canceled)
(canceled)
(canceled)
-25. (canceled)
(canceled)
(canceled)
Dependencies are inferred from the claim text.