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US 2018/0002525 A9Published application
Polymer composition, electronic device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMoon Il Jung, In Kim, Kyeong Pang
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Abstract
The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.
Claims20
A polymer composition, comprising:
- a thermoplastic resin at 30 to 70 parts by weight;
- an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight;
- and
- a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.
1 more element
An electronic device comprising:
- a polymer composition which includes:
- a thermoplastic resin at 30 to 70 parts by weight,
- an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight, and
- a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.
1 more element
A method of manufacturing an electronic device, the method comprising:
- mixing:
- a thermoplastic resin at 30 to 70 parts by weight,
- co-friendly resin, including a bio-resin, at 1 to 50 parts by weight, and
- a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition;
- adding the mixed polymer composition into a hopper of an extruder to produce the polymer composition in a pellet form;
- and
- adding the pellet into an injection molding device for injection molding.
4 more elements
Dependencies are inferred from the claim text.