US 2018/0002485 A1Published application

Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

AssigneeHitachi Chemical Company, Ltd.

InventorsTakao TANIGAWA, Tetsuroh IRINO, Yuusuke KONDOU, Yuichi SHIMAYAMA, Etsuo MIZUSHIMA, Tomio FUKUDA, Yuki NAGAI, Hikari MURAI

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Abstract

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Claims15

Dependent claims

A resin composition comprising a compound having a maleimido group, a divalent group having at least two imido bonds, and a saturated or unsaturated divalent hydrocarbon group.

Dependencies are inferred from the claim text.

Facts

Application: 15/543,078Filed 13 Jan 2016
Priority: JP 2015-00407013 Jan 2015
Published: 4 Jan 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification20 codes

C08G 73/10
Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule: polyimides; Polyester-imides;…
B32B 27/281
Comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42: comprising polyimides
B32B 27/34
Layered products comprising a layer of synthetic resin: comprising polyamides
C08G 73/1014
Containing chain terminating or branching agents: in the form of anhydrid

Family

US 11,286,346 B2Related patent
US 2018/0002485 A1This patent

From the US filing history. Foreign family members aren’t listed.

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