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US 2018/0002239 A1Published application
Method of Joining Metal-Ceramic Substrates to Metal Bodies
AssigneeIXYS Semiconductor GmbH
InventorHeiko Knoll
Life of this patent
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Abstract
A method of joining a metal-ceramic substrate having metalization on at least one side to a metal body by using a metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm, and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.
Claims21
1-12. (canceled)
A module comprising:
- a metal-ceramic substrate having metalization on at least one side, wherein the metal-ceramic substrate is adapted to have a semiconductor component disposed on at least one metalized side of the metal-ceramic substrate, and wherein the metal-ceramic substrate includes a ceramic substrate and no more than two metal layers each of which directly contacts the ceramic substrate;
- a metal body having a thickness of less than 1 mm;
- and
- a joining region joining the ceramic substrate to the metal body, the joining region including a metal alloy containing aluminum and having a liquidus temperature of greater than 450° C.
1 more element
A module comprising:
- a metal-ceramic substrate adapted to have a semiconductor component disposed on at least one metalized side of the metal-ceramic substrate, wherein the metal-ceramic substrate includes a ceramic substrate and no more than two metal layers;
- a metal body having a thickness of less than 1 mm;
- and
- a metal alloy that includes aluminum and that has a liquidus temperature of at least 450° C., wherein the metal alloy is disposed between the metal-ceramic substrate and the metal body, wherein an upper surface of the metal alloy contacts a lower surface of the metal-ceramic substrate, wherein a lower surface of the metal alloy contacts an upper surface of the metal body, and wherein the metal-ceramic substrate is bonded to the metal body such that a peel force for separating the metal-ceramic substrate from the metal body exceeds 3 N/mm.
1 more element
Dependencies are inferred from the claim text.