Apparatus and methods for micro-transfer-printing
AssigneeX-Celeprint Limited
InventorsChristopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
Life of this patent
Estimating the term…
Abstract
In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
Claims21
1-74. (canceled)
A method for assembling a semiconductor device on a receiving surface of a destination substrate, the method comprising:
- providing the semiconductor device formed on a native substrate;
- providing a conformable transfer device having a contact surface;
- contacting the semiconductor device with the conformable transfer device in a vertical direction, wherein contact between the contact surface and the semiconductor device at least temporarily binds the semiconductor device to the conformable transfer device;
- moving the lower of the conformable transfer device and the native substrate downward to separate the semiconductor device from the native substrate so that the semiconductor device is disposed on the contact surface of the conformable transfer device and is released from the native substrate;
- contacting the semiconductor device disposed on the contact surface to the receiving surface of the destination substrate;
- and
- separating the contact surface of the conformable transfer device from the semiconductor device so that the semiconductor device is transferred onto the receiving surface, thereby assembling the semiconductor device on the receiving surface of the destination substrate.
A motion system for separating a semiconductor device formed on a native substrate from the native substrate, comprising:
- a conformable transfer device having a contact surface;
- a vertical stage for holding the native substrate in vertical alignment with the conformable transfer device;
- the vertical stage comprising a mechanism for:
- contacting the semiconductor device with the conformable transfer device in a vertical direction, wherein contact between the contact surface and the semiconductor device at least temporarily binds the semiconductor device to the conformable transfer device;
- and
- moving the lower of the conformable transfer device and the native substrate downward to separate the semiconductor device from the native substrate so that the semiconductor device is disposed on the contact surface of the conformable transfer device and is released from the native substrate.
Dependencies are inferred from the claim text.