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US 2018/0001567 A1Published application
Removable 3d build module comprising a memory
AssigneeHewlett-Packard Development Company, L.P.
InventorsFernando JUAN, Pau MARTIN VIDAL, Esteve COMAS, Jordi GIMENEZ MANENT, Pol MORRAL, Pablo DOMINGUEZ PASTOR
Life of this patent
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Abstract
A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
Claims15
A removable build module to be connected to and removed from a host apparatus, comprising
- a build material storage compartment to store build material,
- a build platform to support an object to be built,
- a drive unit to move the build platform,
- a memory including a data field to receive and store at least one build parameter, and
- an interface circuit to connect to an interconnect circuit of a host apparatus, to exchange the at least one build parameter with the host apparatus.
2 more elements
A removable build module to removably connect to a host apparatus, comprising
- internal components including
- a build platform to support an object-to-be-built, and
- a drive unit to move the build platform;
- and
- at least one memory
- to receive and store build parameters,
- to receive and store at least one internal component state, and
- storing fixed calibration parameters;
- and
- an interface circuit to communicate the build parameters, internal component state and calibration parameters to different host apparatuses.
7 more elements
Dependencies are inferred from the claim text.