Lead-free solder alloy
AssigneeSenju Metal Industry Co., Ltd.
InventorsMasayuki SUZUKI, Naoko IZUMITA, Shunsaku YOSHIKAWA, Ken TACHIBANA, Rei FUJIMAKI, Hikaru NOMURA
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Abstract
Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.
Claims12
A lead-free solder alloy having an alloy composition comprising:
- 1.0 to 6.5 wt % of In, more than 3.0 wt % but not more than 4.0 wt % of Bi, 1.0 to 3.0 wt % of Ag, 0.02 to 0.08 wt % of Ni, 0.03 to 0.09 wt % of Sb, and a balance of Sn.
A lead-free solder alloy having an alloy composition comprising:
- 1.0 to 6.0 wt % of In, more than 3.0 wt % but not more than 4.0 wt % of Bi, 2.0 to 3.0 wt % of Ag, 0.03 to 0.07 wt % of Ni, 0.05 to 0.08 wt % of Sb, and a balance of Sn.
A lead-free solder alloy having an alloy composition comprising:
- 1.0 to 7.0 wt % of In, 3.0 to 5.5 wt % of Bi, 1.0 to 4.0 wt % of Ag, 0.01 to 0.2 wt % of Ni, 0.01 to 0.09 wt % of Sb, and a balance of Sn.
Dependencies are inferred from the claim text.