Nonplanar wafer and method for producing a nonplanar wafer
AssigneeSiltectra GmbH
InventorJan Richter
Life of this patent
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Abstract
The invention relates to a method for cutting off at least one portion (4), in particular a wafer, from a solid body (2). The method comprises at least the following steps: modifying the crystal lattice of the solid body (2) by means of a modifier (18), wherein a number of modifications (19) are produced to form a nonplanar, in particular convex, detachment region (8) in the interior of the solid body, wherein the modifications (19) are produced in accordance with predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the portion (4) and a defined further treatment of the portion (4), detaching the portion (4) from the solid body (2).
Claims11
A method for separating at least one solid body portion (4), in particular a wafer, from a solid body (2), comprising at least the following steps:
- modifying the crystal lattice of the solid body (2) by means of a modifier (18),
- wherein a number of modifications (19) are produced, to form a non-planar, in particular convex, detachment region (8) in the interior of the solid body (2),
- wherein the modifications (19) are produced in dependence of predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the solid body portion (4) in dependence of a defined further treatment of the solid body portion (4),
- detaching the solid body portion (4) from the solid body (2).
The method according to one of the preceding claims,
- characterised in that,
- by means of the modifications (19), more than 5%, in particular more than 10% or more than 20% or more than 50% or more than 80% of the crystal lattice formed during the development of the detachment region (8) is changed, in particular damaged.
The method according to one of the preceding claims,
- characterised in that,
- the detachment of the solid body portion (4) from the solid body (2) comprises at least the following steps:
- arranging a receiving layer (10) on the solid body (2) to hold the solid body portion (4), and
- thermally impacting the receiving layer (10) for the, in particular mechanical, production of stresses in the solid body (2),
- wherein the stresses cause propagation of a crack in the solid body (2) along the detachment region (8), by which the solid body portion (4) is separated from the solid body (2).
A method for manufacturing a multi-layer arrangement, comprising at least the following steps:
- providing a wafer (4) with a first, in particular convex, non-planar form;
- arranging or producing a further layer (50) on at least one surface (40, 42) of the wafer (4);
- wherein the further layer (50) and the wafer (4) have different thermal expansion coefficients,
- wherein the further layer (50) is arranged or produced on the surface (40, 42) of the wafer (4) at a coating temperature which is different from the target temperature, and
- wherein the further layer (50) is formed in such a way that on reaching the target temperature it subjects the wafer (4) to forces in such a way that the wafer (4) is deformed, from the first non-planar shape into a second shape which is different from the first shape, wherein the second shape preferably represents a planar shape.
A non-planar wafer (4),
- manufactured according to a method comprising at least the following steps:
- providing a solid body (2) from which to separate the non-planar wafer (4);
- modifying the crystal lattice of the solid body (2) by means of a modifier (18), in particular a laser, in particular a picosecond laser or a femtosecond laser,
- wherein a number of modifications (19) are produced in the crystal lattice in order to form a non-planar detachment region (8),
- wherein the modifications (19) are produced in dependence of predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the solid body portion (4) in dependence of a defined further treatment of the solid body portion (4),
- detaching the solid body portion (4) from the solid body (2).
Dependencies are inferred from the claim text.