Interposer electrical interconnect with spring
AssigneeKoninklijke Philips N.V.
InventorDINO FRANCESCO CUSCUNA
Life of this patent
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Abstract
An interposer with a spring on a surface of the interposer is disclosed. The spring may apply a force to a surface of a component adjacent to the interposer. The interposer may be secured to the surface by a fastener. The fastener may be offset from the center of the interposer. The fastener may be a fulcrum of a lever including the interposer and the spring. The spring may cause a portion of the interposer on the other side of the fastener from the spring to apply an increased amount of pressure to the surface to which the interposer is secured. A transesophageal exam ultrasound probe including an interposer is disclosed.
Claims21
(canceled)
The ultrasound probe of claim 10, wherein the opening is offset from a center of the interposer.
The ultrasound probe of claim 10, wherein the pad field and the spring are on opposing sides of the opening in the first surface.
The ultrasound probe of claim 10, wherein the spring is a cantilever spring.
The ultrasound probe of claim 10, wherein the spring is a coil spring.
The ultrasound probe of claim 10, wherein the spring is offset from a center of the interposer.
The ultrasound probe of claim 10, wherein the spring is soldered to the first surface of the interposer.
The ultrasound probe of claim 10, wherein the spring is an integrated component of the first surface of the interposer.
The ultrasound probe of claim 10, wherein the spring is stainless steel.
An ultrasound probe, comprising:
- a backing layer having a lower surface;
- a flexible circuit covering a portion of the lower surface of the backing layer;
- an interposer including:
- a first surface and a second surface opposite the first surface, the first surface adjacent to the flexible circuit opposite the lower surface of the backing layer;
- a pad field on the first surface at a first end of the interposer;
- and
- an opening between the first end and a second end of the interposer, the opening extending through the first surface and through the second surface;
- a fastener that passes through the opening in the interposer, the fastener configured to secure the interposer and flexible circuit against the lower surface of the backing layer;
- and
- a spring disposed at the second end of the interposer and disposed between the first surface of the interposer and the backing layer, the spring configured to provide a force to bias the second end of the interposer away from the backing layer and to bias the first end of the interposer toward the backing layer;
- and
- a printed circuit board adjacent to the second surface of the interposer opposite the flexible circuit.
A method, comprising:
- applying a force to a first portion of a surface of a component with a spring adjacent to a first end of an interposer that is adjacent to the component;
- and
- distributing, with a fulcrum, the force to a second end of the interposer to apply a force to a second portion of the surface of the component, wherein the second end and first end of the interposer are on opposite sides of the fulcrum.
21-24. (canceled)
Dependencies are inferred from the claim text.