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US 2018/0000412 A1Published application
Via and trench filling using injection molded soldering
AssigneeInternational Business Machines Corporation
InventorsJohn U. Knickerbocker, Shriya Kumar, Jae-Woong Nah
Life of this patent
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Abstract
A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.
Claims16
A method comprising:
- forming one or more trenches in a first substrate;
- forming one or more vias in a second substrate;
- aligning at least a first trench in the first substrate with at least a first via in the second substrate;
- depositing a delivery substance in a reservoir formed in the second substrate;
- and
- bonding the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering, wherein bonding the first substrate to the second substrate seals the delivery substance between the first substrate and the second substrate.
3 more elements
(canceled)
16-20. (canceled)
Dependencies are inferred from the claim text.