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US 2017/0374759 A1Published application
Thermal interface material structures
AssigneeInternational Business Machines Corporation
InventorsMARK K. HOFFMEYER, PHILLIP V. MANN
Life of this patent
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Abstract
In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer and a second thermal interface material layer. The second thermal interface material layer at least partially overlaps the first thermal interface material layer.
Claims10
-11. (canceled)
A process comprising:
- selectively applying a gap filler material to a surface of a heat transfer component to form a first thermal interface material layer;
- and
- applying a solid thermal pad to the first thermal interface material layer to form a second thermal interface material layer of a thermal interface material structure having one or more overlapping regions associated with at least partial overlap of the first thermal interface material layer by the second thermal interface material layer.
Dependencies are inferred from the claim text.