Power module having packaging structure
AssigneeDelta Electronics, Inc.
InventorsWei-Hao CHI, Hsueh-Kuo LIAO
Life of this patent
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AssigneeDelta Electronics, Inc.
InventorsWei-Hao CHI, Hsueh-Kuo LIAO
Estimating the term…
A power module having a packaging structure includes a substrate having a first conductive area, a second conductive area, a third conductive area, a first fixing area and a second fixing area. The first, the second and the third conductive areas are electrically connected to a first terminal, a second terminal and a third terminal, and the first and the second fixing areas are electrically connected to a first switch set and a second switch set, so that they are in a parallel arrangement. The first terminal is a current input end, the second terminal is an intermediate end, and the third terminal is a current output end. When a current flows from the current input end to the intermediate end, or from the intermediate end to the current output end, the current flows straightly in order to reduce a crossover area and lower the stray inductance.
A power module, having a packaging structure, electrically connected to an outside circuit, and comprising:
Dependencies are inferred from the claim text.