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US 2017/0374474 A1Published application
Mems transducer package
AssigneeCirrus Logic International Semiconductor Ltd.
InventorTsjerk HOEKSTRA
Life of this patent
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Abstract
A MEMS transducer package (1) is provide having a semiconductor die portion (3) with a thickness bounded by a first surface (9) and an opposite second surface (11). The package further has a transducer element (13) incorporated in the second surface (11) and a die back volume (7) that extends through the thickness of the semiconductor die portion (3) between the first surface (9) and the transducer element (13). The package is completed by a cap portion (23) that abuts the semiconductor die portion (3) at the first surface (9).
Claims17
A MEMS transducer package comprising:
- a semiconductor die portion having a thickness bounded by a first surface and an opposite second surface;
- a transducer element incorporated in the second surface;
- a die back volume that extends through the thickness of the semiconductor die portion between the first surface and the transducer element;
- and
- a cap portion that abuts the semiconductor die portion at the first surface.
2 more elements
-18. (canceled)
Dependencies are inferred from the claim text.