Mems transducer package
AssigneeCirrus Logic International Semiconductor Ltd.
InventorsTsjerk HOEKSTRA, David Talmage PATTEN
Life of this patent
Estimating the term…
Abstract
A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).
Claims43
A MEMS transducer package comprising:
- a semiconductor die portion having a thickness bounded by a first surface and an opposite second surface;
- a transducer element incorporated in the second surface;
- a die back volume that extends through the thickness of the semiconductor die portion between the first surface and the transducer element;
- and
- an acoustic die channel that extends through the thickness of the semiconductor die portion between the first surface and the second surface.
-10. (canceled)
(canceled)
A MEMS transducer package as claimed in claim 9, wherein the acoustic cap channel interfaces with the acoustic die channel to provide an acoustic path between a first opening formed in the second surface of the semiconductor die portion and a second opening formed in a side surface (10, 12) of the transducer package.
-22. (canceled)
-46. (canceled)
(canceled)
(canceled)
A semiconductor die portion for use in a MEMS transducer package, the semiconductor die portion comprising:
- a thickness bounded by a first surface and an opposite second surface, wherein the second surface incorporates a transducer element;
- a die back volume that extends through the thickness of the semiconductor die portion between the first surface and the transducer element, and
- an acoustic die channel that extends through the thickness of the semiconductor die portion between the first surface and the second surface.
-55. (canceled)
A MEMS transducer package comprising:
- a semiconductor die element;
- and
- a cap element;
- wherein the semiconductor die element and cap element have mating surfaces,
- wherein the semiconductor die element and cap element are configured such that when the semiconductor die element and cap element are conjoined:
- a first volume is formed through the semiconductor die element and into the semiconductor cap element;
- and
- an acoustic channel is formed to provide an opening between a non-mating surface of the semiconductor die element and either a side surface of the transducer package or a non-mating surface of the cap element.
-67. (canceled)
Dependencies are inferred from the claim text.