Bezels For Die Level Packaging Of Camera Modules, And Associated Camera Modules And Methods
AssigneeOmniVision Technologies, Inc.
InventorsWei-Ping Chen, Tsung-Wei Wan
Life of this patent
Estimating the term…
Abstract
A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing in a second direction opposite the first direction, wherein the planar rim is configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, wherein transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeds corresponding transverse extent of the recessed lip.
Claims24
A bezel for die level packaging of a camera module, comprising:
- a recessed lip surrounding an aperture of the bezel and facing in a first direction, the recessed lip being configured for seating thereon an image sensor;
- and
- a planar rim surrounding the aperture and facing in a second direction opposite the first direction, the planar rim being configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeding corresponding transverse extent of the recessed lip.
A camera module, comprising:
- a wafer-level lens unit including at least one wafer-level lens, the wafer-level lens unit having first transverse extent in a first dimension orthogonal to optical axis of the wafer-level lens;
- an image sensor having second transverse extent, in a second dimension parallel to light-receiving surface of the image sensor, the second transverse extent being smaller than the first transverse extent;
- and
- a bezel having:
- (a) opposite facing first and second sides, the wafer-level unit being bonded to the first side and the image sensor being inserted into the second side and bonded to the bezel, such that the first dimension is aligned with the second dimension, and
- (b) an aperture configured to transmit light from the wafer-level lens to the light-receiving surface.
A method for die-level packaging of a camera module, comprising:
- placing a bezel on an image sensor to seat the image sensor in the bezel, the bezel having an aperture allowing light transmission through the bezel to light receiving surface of the image sensor, the image sensor having first transverse extent in a first dimension parallel to light-receiving surface of the image sensor;
- and
- bonding a wafer-level lens unit to side of the bezel facing away from the image sensor, the wafer-level lens unit including at least one wafer-level lens, the wafer-level lens unit having second transverse extent orthogonal to optical axis of the wafer-level lens, the second transverse extent exceeding the first transverse extent.
Dependencies are inferred from the claim text.