P-n separation metal fill for flip chip leds

A light-emitting device, comprising:

• a semiconductor structure, including a first conductivity layer, an active layer, and a second conductivity layer, the semiconductor structure having a bottom surface and a top surface;
• a first electrode opposing the bottom surface and electrically connected to the first conductivity layer, the first electrode having a first sidewall;
• a second electrode opposing the bottom surface and electrically connected to the second conductivity layer, the second electrode having a second sidewall facing the first sidewall;
• a dielectric layer formed on at least one of the first sidewall and the second sidewall;
• and
• a metal layer arranged to at least partially fill a gap between the first sidewall of the first electrode and the second sidewall of the second electrode, the metal layer being electrically insulated from at least one of the first sidewall and the second sidewall by the dielectric layer.

A light-emitting device, comprising:

• a semiconductor structure, including a first conductivity layer, an active layer, and a second conductivity layer, the semiconductor structure having a bottom surface and a top surface;
• a first electrode opposing the bottom surface and electrically connected to the first conductivity layer, the first electrode having a first sidewall;
• a second electrode opposing the bottom surface and electrically connected to the second conductivity layer, the second electrode having a second sidewall facing the first sidewall;
• a dielectric layer formed over the first electrode and the second electrode, the dielectric layer having being patterned to partially expose the first electrode and the second electrode;
• and
• a metal layer formed over the dielectric layer and arranged to at least partially fill a gap between the first layer and the second layer, the metal layer including a first portion that is electrically connected to the first electrode through the dielectric layer and a second portion that is electrically connected to the second electrode through the dielectric layer, the second portion being electrically insulated from the first portion.