Lead Frame
AssigneeOSRAM Opto Semiconductors GmbH
InventorsWeng Chung Tan, Rodello Cadiz Sigalat, Hussen Mohd Hanifah, Tobias Gebuhr
Life of this patent
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Abstract
A lead frame is disclosed. In an embodiment, the lead frame includes a frame having a plurality of lead frame sections, wherein the lead frame sections are connected to the frame, wherein the frame has at least two longitudinal sides and at least two transverse sides, wherein at least in one longitudinal side includes an imprint, and wherein the imprint bolsters stability of the longitudinal side against sagging.
Claims18
1-15. (canceled)
A lead frame comprising:
- a frame having a plurality of lead frame sections, wherein the lead frame sections are connected to the frame, wherein the frame has at least two longitudinal sides and at least two transverse sides, wherein at least in one longitudinal side comprises an imprint, and wherein the imprint bolsters stability of the longitudinal side against sagging.
A method for producing a lead frame having a molding material layer, the method comprising:
- placing the lead frame into a mold, the mold having two mold pails forming a molding space for a soft molding material when the mold parts are moved relative to one another, wherein one mold part has a stamping tool;
- stamping an imprint in the lead frame with the stamping tool when the mold parts are moved relative to one another;
- and
- applying the soft molding material to the lead frame in the molding space.
A mold comprising:
- at least two mold parts,
- wherein the mold parts are moveable relative to one another, and
- wherein at least one mold part has a stamping tool for making an imprint in a lead frame.
Dependencies are inferred from the claim text.