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US 2017/0373207 A1Published application
Solar cell module, method for manufacturing solar cell module, method for manufacturing electronic device having solar cell module
AssigneeLG Electronics Inc.
InventorsEonjoo HWANG, Jungguen KIM, Yong SONG, Jeonghun WOO, Joonho JEON
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Abstract
A solar cell module can include a printed circuit board (PCB) having an electrode connection part, at least one solar cell mounted on the PCB and electrically connected to the electrode connection part, and an encapsulant layer covering the solar cell and formed of a material including silicon.
Claims20
A solar cell module comprising:
- a printed circuit board (PCB) having an electrode connection part;
- at least one solar cell mounted on the PCB and electrically connected to the electrode connection part;
- and
- an encapsulant layer covering the at least one solar cell and formed of a material including silicon.
1 more element
A method for manufacturing a solar cell module, the method comprising:
- preparing a printed circuit board (PCB) having an electrode connection part;
- mounting at least one solar cell on one surface of the PCB;
- dispensing a liquid encapsulant layer material formed of a material including silicon to cover the at least one solar cell;
- thermally curing the encapsulant layer material to form an encapsulant layer;
- and
- cutting a solar cell module assembly formed by the preparing operation and the thermally curing operation into a unit size of a solar cell module.
3 more elements
A method for manufacturing a solar cell module, the method comprising:
- preparing a printed circuit board (PCB) having an electrode connection part on a first surface thereof and having a circuit wiring on a second surface thereof facing a direction opposite to a direction of the first surface;
- and
- performing a first process of forming a solar cell and an encapsulant layer on the first surface of the PCB and a second process of mounting a circuit component or an electric element on the second surface of the PCB regardless of order,
- wherein,
- in the first process, the solar cell is mounted on the first surface so as to be electrically connected to the electrode connection part, and the encapsulant layer is subsequently formed on the solar cell, and
- in the second process, the circuit component or the electric element is mounted on the second surface using a surface mount technology of mounting a component by applying heat in a furnace.
3 more elements
Dependencies are inferred from the claim text.