Semiconductor structure
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorHao DENG
Life of this patent
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AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorHao DENG
Estimating the term…
A method for forming a semiconductor structure includes providing a semiconductor substrate having a metal gate structure formed on the semiconductor substrate; forming a first dielectric layer covering a side surface of the metal gate structure on the semiconductor substrate; forming a cap layer on the metal gate structure; etching a top portion of the first dielectric layer using the cap layer as an etching mask; forming a protective sidewall spacer on a side surface of the cap layer and a side surface of a portion of the first dielectric layer under the cap layer; forming a second dielectric layer to cover the cap layer, the protective sidewall spacer and a top surface of the etched first dielectric layer; forming at least a first through-hole in the second dielectric layer; and forming a first conductive via in the first through-hole.
-14. (canceled)
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.