Wiring substrate and semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorKosuke Tsukamoto
Life of this patent
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Abstract
A wiring substrate includes a first insulating layer including a first through-hole formed through the first insulating layer in a thickness direction, a wiring layer formed on a lower surface of the first insulating layer, and a via wiring filled in the first through-hole and connected to the wiring layer, the via wiring having such a shape that it gradually becomes thinner from one side close to the lower surface of the first insulating layer toward the other side close to an upper surface of the first insulating layer, the via wiring including a first recess formed in an upper end surface of the via wiring. An upper end portion of the via wiring is an electrode pad for electric connection with an electronic component.
Claims6
A wiring substrate comprising:
- a first insulating layer including a first through-hole formed through the first insulating layer in a thickness direction;
- a wiring layer formed on a lower surface of the first insulating layer;
- and
- a via wiring filled in the first through-hole and connected to the wiring layer, the via wiring having such a shape that it gradually becomes thinner from one side close to the lower surface of the first insulating layer toward the other side close to an upper surface of the first insulating layer, the via wiring including a first recess formed in an upper end surface of the via wiring,
- wherein an upper end portion of the via wiring is an electrode pad for electric connection with an electronic component.
Dependencies are inferred from the claim text.