Exposed side-wall and lga assembly

A device package, comprising:

• a substrate;
• a through-substrate via (TSV) extending from a top surface of the substrate to a bottom surface of the substrate;
• a trace on the top surface of the substrate and configured to electrically couple to a contact pad on the bottom surface of the substrate, wherein the trace and the contact pad are electrically coupled together through the TSV;
• a die above the substrate and configured to electrically couple to the trace;
• and
• a mold on the top surface of the substrate and encapsulating the die,
• wherein a sidewall of the TSV is not covered by the substrate,
• wherein at least a portion of the TSV is within an outer side boundary of the substrate, and
• wherein the trace and the contact pad are within the outer side boundary of the substrate.

An assembly for a device package, comprising:

• a substrate;
• means for providing a through-substrate conduction extending from a top surface of the substrate to a bottom surface of the substrate;
• and
• a trace on the top surface of the substrate and configured to electrically couple to a contact pad on the bottom surface of the substrate, wherein the trace and the contact pad are electrically coupled together through the means for providing the through-substrate conduction,
• wherein a sidewall of the means for providing the through-substrate conduction is not covered by the substrate,
• wherein at least a portion of the means for providing the through-substrate conduction is within an outer side boundary of the substrate, and
• wherein the trace and the contact pad are within the outer side boundary of the substrate.