Method for preparing electrode

A method for preparing an electrode, wherein, comprises:

• providing a substrate;
• forming a buffer layer on the substrate;
• forming a patterned photoresist on the surface of the buffer layer away from the substrate, the photoresist has a bottom surface and a top surface disposed opposite and a side connected between the bottom surface and the top surface, the bottom surface is bonded to the buffer layer;
• by dry etching, the portions of the photoresist not covered by the buffer layer is removed to form a receiving area;
• depositing a conductive film, the conductive film layer comprises a waste material forming on the top surface and an electrode filling in the receiving area;
• stripping the waste material and the photoresist;
• and
• wherein, the buffer layer has a first thickness T1, an angle α is formed between the side and the bottom surface of the photoresist, the side perpendicular to the direction of the bottom surface has a second thickness T2, satisfy:
• 75°≦α≦90° and T2≧2T1, so that mutual cut off between the waste material and the electrode.