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US 2017/0372885 A1Published application
Manufacturing process of wafer thinning
AssigneePhoenix Silicon International Corporation
InventorsSHIH-CHING YANG, CHIEN-HSIUNG HUANG, CHAO-TSUNG TSOU, CHENG-YEN LIN
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Abstract
A manufacturing process of wafer thinning includes a step of wafer-grinding to grind a surface of a wafer to a first predetermined thickness, and a step of wafer-etching to etch the grinded face of the wafer with the first predetermined thickness to a second predetermined thickness.
Claims10
A manufacturing process of wafer thinning, comprising the steps of:
- wafer-grinding, grinding a face of a wafer so as to make the wafer to have a first predetermined thickness;
- and
- wafer-etching, etching the face of the wafer with the first predetermined thickness so as to make the wafer to have a second predetermined thickness.
Dependencies are inferred from the claim text.