Two-dimensional structure to form an embedded three-dimensional structure

A method for forming an embedded three-dimensional (3D) coil, comprising:

• forming a plurality of vias on a substrate, wherein forming each of the plurality of vias comprises:
• plating a first two-dimensional conductive layer on a first side of the substrate, the first two-dimensional conductive layer having a defined shape,
• plating a second two-dimensional conductive layer on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and
• forming a via through the substrate to conductively couple the first two-dimensional conductive layer to the second two-dimensional conductive layer;
• and
• forming a plurality of interconnects to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.

An apparatus, comprising:

• a plurality of vias each having a defined shape, wherein each of the plurality of vias comprises:
• a first two-dimensional conductive means plated on a first side of a substrate, the first two-dimensional conductive means having the defined shape,
• a second two-dimensional conductive means plated on a second side of the substrate, the second two-dimensional conductive means having the defined shape, and
• means for conductively coupling the first two-dimensional conductive means to the second two-dimensional conductive means;
• and
• a plurality of interconnects configured to conductively couple the plurality of vias, wherein the first two-dimensional conductive means and the second two-dimensional conductive means of each of the plurality of vias are perpendicular to the plurality of interconnects.

A non-transitory computer-readable medium storing computer executable code, the code comprising code to:

• cause a machine to form a plurality of vias on a substrate, wherein code to cause a machine to form each of the plurality of vias comprises code to:
• cause a machine to plate a first two-dimensional conductive layer on a first side of the substrate, the first two-dimensional conductive layer having a defined shape,
• cause a machine to plate a second two-dimensional conductive layer on a second side of the substrate, the second two-dimensional conductive layer having the defined shape, and
• cause a machine to form a via through the substrate to conductively couple the first two-dimensional conductive layer to the second two-dimensional conductive layer;
• and
• cause a machine to form a plurality of interconnects to conductively couple the plurality of vias, wherein the first two-dimensional conductive layer and the second two-dimensional conductive layer of each of the plurality of vias are perpendicular to the plurality of interconnects.