Apparatuses, methods, and systems for package on package memory refresh and self-refresh rate management

A method comprising:

• providing a die comprising a core and a graphics processor;
• providing a dynamic memory die mounted to and overlapping the die, wherein a first thermal sensor of the die is disposed adjacent to a first hot spot from a workload of the graphics processor and a second thermal sensor of the die is disposed adjacent to a second hot spot from a workload of the core;
• and
• causing, with a hardware control circuit of the die, a refresh of a capacitor of the dynamic memory die when either of an output of the first thermal sensor exceeds a first threshold value and an output of the second thermal sensor exceeds a second threshold value.

An apparatus comprising:

• a system on a chip die comprising a core and a graphics processor;
• a dynamic memory die mounted to and overlapping the system on a chip die;
• a first thermal sensor in the core of the system on a chip die disposed adjacent to a first hot spot from a workload of the core and a second thermal sensor in the graphics processor of the system on a chip die disposed adjacent to a second hot spot from a workload of the graphics processor;
• and
• a hardware control circuit of the system on a chip die to cause a refresh of a capacitor of the dynamic memory die when either of an output of the first thermal sensor exceeds a first threshold value and an output of the second thermal sensor exceeds a second threshold value.