Method for producing a single-sided electronic module including interconnection zones
AssigneeGemalto SA
InventorsStéphane OTTOBON, Lucile DOSSETTO, Luc CHARLES, Thierry LAVIRON
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Abstract
The invention relates to a method for producing a module having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.
Claims18
1-11. (canceled)
A method for manufacturing a module having an electronic chip, comprising:
- metallisations accessible from a first side of the metallisations and an integrated-circuit chip disposed on the second side of the metallisations, opposite to the first side,
- electrical interconnection elements, separate from the metallisations, directly connecting the chip and disposed on the second side of the metallisations,
- wherein the electrical interconnection elements are produced on a single-face module.
A module having an electronic chip, comprising:
- metallisations accessible from a first side of the metallisations and an integrated-circuit chip disposed on the second side of the metallisations, opposite to the first side,
- electrical interconnection elements, separate from the metallisations, directly connecting the chip and disposed on the second side of the metallisations,
- wherein the electrical interconnection elements are disposed on a single-face module.
Dependencies are inferred from the claim text.