Fiber optic weight sensor optimization for landing gear
AssigneeSikorsky Aircraft Corporation
InventorsMichael G. Mastrianni, Payman Sadegh, Mark W. Davis, John H. Judge
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Abstract
A measuring system and method that computes and analyzes sensor data fused with multiple mechanical and thermally induced strain measurements is provided. Further, the measuring system and method realizes physics-based relations between sensor readings due to mechanical and thermal sources by optimally de-coupling a total strain into its mechanical and thermal components. The measuring system and method also auto-tunes coefficients involved in the optimal de-coupling equations using sensor specification data and previous system test results for initialization.
Claims12
A computing device for computing a mechanical strain, communicatively coupled to a sensor sub-system that is physically coupled to a mechanical structure, the computing device configured to:
- receive a plurality of physical characteristics from the sensor sub-system that includes a first total strain detected by a first sensor oriented in a first direction and a second total strain detected by a second sensor oriented in a second direction;
- de-couple each of the first and second total strain into isolated first and second strain components;
- and
- compute the mechanical strain applied to the mechanical structure based on the isolated first and second strain components.
A method for computing a mechanical strain of a mechanical structure, comprising:
- receiving, by a computing device communicatively coupled to a sensor sub-system that is physically coupled to a mechanical structure, a plurality of physical characteristics from the sensor sub-system that includes a first total strain detected by a first sensor oriented in a first direction and a second total strain detected by a second sensor oriented in a second direction;
- de-coupling, by the computing device, each of the first and second total strain into isolated first and second strain components;
- and
- computing, by the computing device, the mechanical strain applied to the mechanical structure based on the isolated first and second strain components.
Dependencies are inferred from the claim text.