Back to results
US 2017/0370569 A1Published application
Optical module
AssigneeHisense Broadband Multimedia Technologies Co., Ltd.
InventorsPeng He, Haiqiang Xu, Sigeng Yang, Shuai Zhang
Life of this patent
Estimating the term…
Abstract
An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.
Claims19
An optical module, comprising:
- a housing;
- two or more circuit board layers disposed in the housing and electrically connected to each other;
- and
- a light emitting chip electrically connected to at least one of the circuit board layers.
1 more element
An optical module, comprising:
- a housing;
- a first rigid circuit board layer disposed in the housing;
- a second circuit board layer disposed in the housing comprising a first substrate, and a first flexible circuit board configured on the first substrate and electrically connected with the first rigid circuit board layer;
- and
- a light emitting chip electrically connected to the second circuit board layer and located in a cavity formed by the first rigid circuit board layer and the second circuit board layer.
2 more elements
An optical module, comprising:
- a housing;
- a laminated structure formed by folding a flexible circuit board, wherein the flexible circuit board comprises a first side with a circuit and a second side without any circuit, and a metal substrate is disposed between two adjacent layers of the folded laminated structure facing each other with the second side;
- and
- a light emitting chip electrically connected to the flexible circuit board.
1 more element
Dependencies are inferred from the claim text.