Inspection apparatus and component mounting system having the same

A component mounting system comprising:

• a solder inspection device comparing coordinate information of the solder, which is obtained through measurement of a substrate on which solder is applied, with reference coordinate information to generate coordinate correction data;
• a front end mounting inspection apparatus inspecting a mounting state of a component to generate a first measurement data;
• and
• an integrated management apparatus verifying an operation state of a component mounting apparatus by comparing the coordinate correction data and the first measurement data.

An inspection apparatus comprising:

• a first inspection unit for inspecting whether a component which is mounted is defective through a first measurement data obtained by measuring a mounting state of the component;
• and
• a first verification unit comparing a coordinate correction data transmitted from a solder inspection apparatus with the first measurement data to verify whether the component is mounted at a position corrected by the coordinate correction data,
• wherein the coordinate correction data is a data generated by comparing coordinate information of the solder, which is obtained through measurement of a substrate to which the solder is applied, with a reference coordinate information.

An inspection apparatus comprising:

• a second inspection unit inspecting whether a component after a reflow process is defective through a second measurement data obtained by measuring a mounting state of the component after the reflow process;
• and
• a second verification unit comparing a coordination correction data transmitted from a solder inspection apparatus, a first inspection data transmitted from a front end mounting inspection apparatus inspecting a mounting state of the component, and the second measurement data to verify coordinate change information of the solder and the component after reflow process,
• wherein the coordinate correction data is a data generated by comparing coordination information of the solder, which is obtained by measuring a substrate with the solder spread thereon, with a reference coordinate information.