Method of providing compartment emi shields on printed circuit board using a vacuum

A method of forming a compartment electromagnetic interference (EMI) shield in a mold cap formed over a printed circuit board (PCB), the method comprising:

• forming a trench in the mold cap extending continuously from a first edge to a second edge of the mold cap, the trench corresponding to a desired location of the compartment EMI shield;
• sealing an elastomeric pad on a top surface of the mold cap to form a channel comprising at least the trench formed in the mold cap;
• activating a vacuum to which the second edge of the mold cap is connected;
• injecting a conductive epoxy into the channel from a dispenser connected to the first edge of the mold cap, wherein the activated vacuum draws the conductive epoxy through the channel to the second edge of the mold cap, filling the channel with the conductive epoxy;
• curing the conductive epoxy;
• and
• removing the elastomeric pad from the top surface of the mold cap.

A method of forming compartment electromagnetic interference (EMI) shields in a mold cap formed over a printed circuit board (PCB), the method comprising:

• forming a plurality of trenches in the mold cap corresponding to desired locations of the compartment EMI shields, each of the plurality of trenches extending continuously from a one edge of the mold cap to another edge of the mold cap;
• sealing an elastomeric pad on a top surface of the mold cap to form a plurality of channels comprising at least the plurality of trenches, respectively;
• activating a vacuum to which the one edge of the mold cap is connected;
• injecting a conductive epoxy into the plurality of channels from a dispenser connected to the another edge of the mold cap, wherein the activated vacuum draws the conductive epoxy through the plurality of channels, filling each of the plurality of channels with the conductive epoxy;
• and
• curing the conductive epoxy to form the compartment EMI shields, each of the compartment EMI shields isolating at least one electronic component within a compartment surrounded by the compartment EMI shield.