Display module with integrated thermal management structure
AssigneeMicrosoft Technology Licensing, LLC
InventorsTaylor Stellman, Andrew D. Delano, Lincoln Ghioni, Kurt A. Jenkins
Life of this patent
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Abstract
Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack.
Claims20
An electronic device comprising:
- a display module comprising:
- a cover lens;
- a display layer disposed behind the cover lens;
- and
- a thermal management structure integrated on a backside of the display module behind the display layer, the thermal management structure comprising a cavity containing a material configured to change phase during operation of the electronic device;
- and
- a heat generating component disposed behind the display module and coupled to a rear external surface of the thermal management structure.
An electronic device comprising:
- a display module having a backlight unit, at least part of the backlight unit comprising a thermal management structure, the thermal management structure comprising a cavity containing a material configured to change phase within a temperature range of about 30 degrees Celsius (° C.) to about 110° C.;
- and
- a heat generating component disposed on a logic board behind the display module.
A method of manufacturing a display module for use in an electronic device, the method comprising:
- providing a cover lens;
- providing a display layer behind a rear surface of the cover lens;
- forming a sheet of heat conducting material;
- creating a recess at an interior region of a surface of the sheet of heat conducting material;
- introducing, within the recess, a material configured to change phase within a temperature range of about 30 degrees Celsius (° C.) to about 110° C.;
- applying a layer of the heat conducting material over the recess to enclose the recess and to create a thermal management structure having a cavity that contains the material;
- and
- providing the thermal management structure behind a rear surface of the display layer.
Dependencies are inferred from the claim text.