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US 2017/0367205 A1Published application
Hermetic sealing lid member and electronic component housing package
AssigneeHitachi Metals, Ltd.
InventorsMasayuki Yokota, Masaharu Yamamoto
Life of this patent
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Abstract
This hermetic sealing lid member (1) is made of a clad material (10) including a base material layer (11) made of an Fe alloy that contains 4 mass % or more of Cr and a silver brazing layer (13) bonded onto a surface of the base material layer on a side closer to an electronic component housing member through an intermediate layer (12).
Claims20
A hermetic sealing lid member (1) used for an electronic component housing package (100) including an electronic component housing member (30) for housing an electronic component (20),
- the hermetic sealing lid member made of a clad material (10) comprising:
- a base material layer (11) made of an Fe alloy that contains 4 mass % or more of Cr;
- and
- a silver brazing layer (13) bonded onto a surface of the base material layer on a side closer to the electronic component housing member through an intermediate layer (12) or bonded in direct contact with the surface of the base material layer on the side closer to the electronic component housing member.
1 more element
An electronic component housing package (100) comprising:
- an electronic component housing member (30) for housing an electronic component (20);
- and
- a hermetic sealing lid member (1) made of a clad material (10) comprising a base material layer (11) made of an Fe alloy that contains 4 mass % or more of Cr, and a silver brazing layer (13) bonded onto a surface of the base material layer on a side closer to the electronic component housing member through an intermediate layer (12) or bonded in direct contact with the surface of the base material layer on the side closer to the electronic component housing member, the hermetic sealing lid member bonded to the electronic component housing member through the silver brazing layer.
Dependencies are inferred from the claim text.