Printed circuit board and manufacturing method thereof

A manufacturing method of a printed circuit board, comprising:

• (a) preparing first printed circuit board and second printed circuit board, the first printed circuit board being provided with a plurality of first terminals, the second printed circuit board being provided with a plurality of second terminals, and at least one of the plurality of first terminals and the plurality of second terminals being coated with respective solders;
• and
• (b) electrically connecting the plurality of first terminals to the plurality of second terminals, respectively, via the respective solder by heating connecting portions of the first printed circuit board and the second printed circuit board to a temperature that is greater than or equal to a melting point of the solder and applying pressure to the connecting portions,
• wherein the plurality of second terminals are arranged along a short axis direction of the second terminals,
• each of the plurality of second terminals includes a first end portion and a second end portion in a long axis direction of the second terminal, and
• in the step (b), pressure is applied to each second terminal such that the height of each of the first end portion and second end portion is larger than the height in another portion of the second terminal.