Printed circuit board including a thick-wall via and method of manufacturing same

A printed circuit board comprising:

• at least one insulating layer;
• first and second conductive layers separated from one another by said at least one insulating layer;
• and
• a conductive via extending through said at least one insulating layer and electrically coupling said first and second conductive layers, said conductive via including an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches), and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).

A printed circuit board assembly comprising:

• at least one insulating layer;
• first and second conductive layers separated from one another by said at least one insulating layer;
• a conductive via extending through said at least one insulating layer and electrically coupling said first and second conductive layers, said conductive via including an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches), and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches);
• and
• an electronic component electrically coupled to said conductive via, said electronic component comprising a pair of conductive leads having a center-to-center spacing of less than about 0.025 inches.