Circuit board with via capacitor structure and manufacturing method for the same
AssigneeChunghwa Precision Test Tech. Co., Ltd.
InventorsWen Tsung LI, Kai Chieh HSIEH, I Hsing WENG
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Abstract
A circuit board with via capacitor structure is introduced herein, including a base, a deposition layer, disposed on the base, having at least a via in the deposition layer, at least a thin film capacitor, each thin film capacitor disposed in each via, each thin film capacitor having a body, a second terminal, and a first terminal, the second terminal and the first terminal located on two opposite sides of the body; at least a first electrode, each first electrode electrically connected to the first terminal of each thin film capacitor; and at least a second electrode, each second electrode electrically connected to the second terminal of each thin film capacitor.
Claims13
A circuit board having a via capacitor structure, comprising:
- a base;
- a deposition layer disposed on the base, having at least one via in the deposition layer;
- at least one thin film capacitor, each of the at least one thin film capacitors disposed in each of the at least one vias, each of the at least one thin film capacitors having a body, a second terminal, and a first terminal, wherein the second terminal and the first terminal are located on two opposite sides of the body;
- at least one first electrode, each of the at least one first electrodes electrically connected to the first terminal of each of the at least one thin film capacitors;
- and
- at least one second electrode, each of the at least one second electrodes electrically connected to the second terminal of each of the at least one thin film capacitors;
- wherein a signal is sent from the first electrode to the second electrode via the body of the at least one thin film capacitor in order to allow a collinear route of the first electrode, the body, and the second electrode to transmit the signal.
A manufacturing method of a circuit board having a via capacitor structure, comprising the following steps:
- disposing at least one first electrode on a substrate of the circuit board;
- covering a deposition layer on the first electrode;
- manufacturing at least one via in the deposition layer;
- disposing at least one thin film capacitor in at least one via, each of the at least one thin film capacitors disposed in each of the at least one vias, each of the at least one thin film capacitors having a body, a second terminal, and a first terminal, wherein the second terminal and the first terminal are located on two opposite sides of the body, each of the at least one first electrodes is electrically connected to the first terminal of each of the at least one thin film capacitor;
- and
- coating at least one second electrode on the at least one thin film capacitor, each of the at least one second electrodes electrically connected to the second terminal of each of the at least one thin film capacitors.
Dependencies are inferred from the claim text.