Array type discrete decoupling under bga grid
AssigneeAlcatel-Lucent Canada Inc.
InventorsJames M. SCHRIEL, Alex L. CHAN, Paul J. BROWN
Life of this patent
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Abstract
Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.
Claims15
A printed circuit board (PCB) for electrically connecting a discrete array component comprising:
- a pattern formed on the PCB including a plurality of merged pads, wherein the merged pads are via pads and discrete array component pads;
- wherein each merged pad is determined by a pin mapping between the discrete array component and a via grid array on the PCB that associates a discrete array pad with a via pad:
- wherein each merged pad is based upon a shape of the associated via pad and the discrete array component pad;
- and
- wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.
A computer aided design (CAD) tool implemented on a computing device for soldering a discrete array component on a printed circuit board (PCB) for use with mounting a component comprising:
- a design tool mode configured to identify a placement of the discrete array component on the PCB and to verify whether pin mapping between the discrete array component and a ball grid array (BGA) on the opposite side of the PCB is feasible;
- a design tool mode configured to determine the geometry of a set of via pads to be associated with the discrete array component and a geometry for the discrete array component;
- and
- a design tool mode configured to generate a pattern on the PCB associated with a merger of the via pads and discrete array component.
A printed circuit board (PCB) for electrically connecting a discrete array component comprising:
- a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component, the discrete array component having at least a 2 X 2 grid;
- wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB,
- wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.
Dependencies are inferred from the claim text.