US 2017/0367177 A1Published application

Electrical interface for printed circuit board, package and die

AssigneeMACOM Technology Solutions Holdings, Inc.

InventorAlfredo Moncayo

Life of this patent

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Abstract

A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads.

Claims20

Dependent claims

An assembly comprising an arrangement of insulating material and conductive material configured to establish an electrical connection between a circuit board to a die, the assembly comprising:

a circuit board comprising:
a circuit board conductive layer serving configured as a ground plane;
an circuit board insulating layer on the conductive layer;
one or more ground vias electrically connected to the circuit board conductive layer;
one or more signal solder pads on the insulating layer;
one or more signal transmission lines formed from conductive material on the insulating layer, the one or more signal transmission lines terminating at the one or more signal solder pads;
a circuit board ground pad electrically connected to two or more ground vias, the two or more ground vias electrically connected to the circuit board conductive layer, the ground pad having a generally concave shaped edge facing the one or more signal solder pads;
a package comprising insulating material and conductive material, the package comprising:
two or more conductors exposed on a package exterior, at least one conductor comprising an exterior ground conductor and at least one conductor comprising an exterior signal conductor such that the exterior signal conductor is configured to electrically connect to at least one signal solder pad on the circuit board and the exterior ground conductor is configured to electrically connect to at least one ground vias on the circuit board;

6 more elements

An assembly comprising an arrangement of insulating material and conductive material configured to establish an electrical connection between a circuit board and a die, the assembly comprising:

a circuit board comprising:
a circuit board ground layer formed of conducting material;
an circuit board insulating layer on the conductive layer;
at least one signal transmission line terminating at and electrically connect to at least one signal solder pad on the circuit board insulating layer;
a circuit board ground pad electrically connected to the circuit board ground layer the ground pad having a generally concave shaped edge facing at least one signal solder pads;
a package comprising insulating material and conductive material, the package comprising:
two or more package ground pads exposed on a package exterior electrically connected to the circuit board ground pad;
one or more package signal pads exposed on a package exterior electrically connected to the signal solder pad;
and
within the package, at least a right hand side ground path electrically connected to at least one package ground pad and left hand side ground path electrically connected to at least one package ground pad;
a package signal path between the right hand side ground path and the left hand side ground path, the package signal path electrically connected at a first end to at least one package signal pad and electrically connected at a second end to signal bond wire.

8 more elements

A circuit board and package assembly configured to electrically connect a die to a circuit board, the assembly comprising:

a circuit board signal path on an insulating layer of the circuit board terminating in a signal pad;
a ground pad on the insulating layer of the circuit board, the circuit board ground pad having a generally concave shaped side that forms a recess such that at least one signal pad is at least partially within the recess formed by the concave shaped side;
a package located on the circuit board such that two or more package ground pad align along the concave shaped side of the circuit board ground pad and at least one package signal pad is at least partially within the recess formed by the concave shaped side of the ground pad, the two or more package ground pads extending upward into the package to electrically connect to package ground to paths and the at least one package signal pad extending upward into the package to electrically connect to a package signal path.

Dependencies are inferred from the claim text.

Facts

Application: 15/185,387Filed 17 Jun 2016
Published: 21 Dec 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

H05K 1/0246
High frequency adaptations: termination of transmission lines
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 1/0298
Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295: multilayer circuits
H05K 1/114
Directly combined with via connections: pad being close to via, but not surrounding the via