Vertically embedded discrete component

A method of embedding a discrete component in a substrate, the method comprising:

• forming a cavity in the substrate;
• inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal;
• positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate;
• forming an intermediate conductive material within the cavity and over the top terminal;
• forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal;
• wherein forming the intermediate conductive material comprises:
• depositing a solder paste over the top terminal;
• and
• reflowing the solder paste to form a reflowed solder material;
• wherein the cavity comprises a top opening extending through a front face of the substrate;
• wherein the reflowed solder material extends above the front face of the substrate;
• wherein forming the intermediate conductive material further comprises planarizing the reflowed solder material.

A substrate comprising:

• a cavity formed in the substrate;
• a discrete component within the cavity;
• wherein the discrete component comprises a top terminal and a bottom terminal;
• wherein the discrete component is positioned within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate;
• an intermediate conductive material within the cavity and over the top terminal;
• and
• a top conductive material formed over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.