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US 2017/0366906 A1Published application
Hearing device with embedded die stack
OwnerAndy Lambertinventor
Life of this patent
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Abstract
Described herein are methods and apparatus in which two integrated circuit dies are stacked and embedded in a printed circuit board (PCB) substrate. In one embodiment, the two dies are stacked directly on top of one another with and electrically connected with through-silicon-vias (TSVs). The interconnect routing between the two die occurs within the TSVs and die level redistribution layer (RDL) routing. The resulting die stack can then be embedded into a single layer of the PCB substrate rather than in two separate layers.
Claims20
An electronic device, comprising:
- a first die;
- a second die;
- a printed circuit board (PCB) substrate;
- wherein the first die is stacked on top of the second die to form a die stack, wherein the first and second dies are electrically connected;
- and,
- wherein the die stack is embedded in a single first layer of the PCB substrate.
3 more elements
A method for constructing an electronic device, comprising:
- stacking a first die is on top of a second die to form a die stack with the first and second dies electrically connected;
- and,
- embedding the die stack in a single first layer of a printed circuit board (PCB) substrate.
A hearing device, comprising:
- a microphone to convert an audio input into a first input signal;
- processing circuitry to process the first input signal, the second input signal, or a combination thereof into an output signal;
- wherein the processing circuitry comprises a first die and a second die and wherein the first die is stacked on top of the second die to form a die stack with the first and second dies are electrically connected;
- and,
- wherein the die stack is embedded in a single first layer of a printed circuit board (PCB) substrate.
2 more elements
Dependencies are inferred from the claim text.