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US 2017/0366172 A1Published application
Contactless readable programmable transponder to monitor chip join
AssigneeInternational Business Machines Corporation
InventorsStephen P. Ayotte, Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan
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Abstract
A contactless readable programmable transponder to monitor chip join and method of use are disclosed. The method includes reading a frequency of an oscillator associated with a chip module. The method further includes correlating the frequency with a bond quality of the chip module.
Claims18
A method comprising completing circuitry of a wireless transponder and ring oscillator by bonding a device substrate to a chip carrier.
A chip module, comprising:
- a device substrate;
- a chip carrier;
- solder connections between the device substrate and the chip carrier;
- circuitry on at least one of the device substrate and the chip carrier forming a wireless transponder associated with the chip module;
- and
- circuitry on both the device substrate and the chip carrier forming a ring oscillator associated with the chip module.
3 more elements
Dependencies are inferred from the claim text.