Mems device for harvesting sound energy and methods for fabricating same
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsAveek Nath Chatterjee, Rakesh Kumar
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Abstract
Micro-Electro-Mechanical System (MEMS) devices for harvesting sound energy and methods for fabricating MEMS devices for harvesting sound energy are provided. In an embodiment, a method for fabricating a MEMS device for harvesting sound energy includes forming a pressure sensitive MEMS structure disposed over a semiconductor substrate and including a suspended structure in a cavity. Further, the method includes etching the semiconductor substrate to form an acoustic port through the semiconductor substrate configured to allow acoustic pressure to deflect the suspended structure.
Claims20
A method for fabricating a Micro-Electro-Mechanical System (MEMS) device for harvesting sound energy, the method comprising:
- forming a pressure sensitive MEMS structure disposed over a semiconductor substrate and including a suspended structure in a cavity;
- and
- etching the semiconductor substrate to form an acoustic port through the semiconductor substrate configured to allow acoustic pressure to deflect the suspended structure.
A method for fabricating an integrated circuit for harvesting sound energy, the method comprising:
- identifying a selected frequency of sound;
- forming a pressure sensitive MEMS structure disposed over a semiconductor substrate and including a suspended structure, wherein the pressure sensitive MEMS structure has a resonant frequency;
- forming a proof mass on the suspended structure to adjust the resonant frequency of the suspended structure to a desired resonant frequency matching the selected frequency of sound;
- and
- etching the semiconductor substrate to form an acoustic port through the semiconductor substrate configured to allow acoustic pressure to deflect the suspended structure.
A sound energy harvesting MEMS device comprising:
- a semiconductor substrate;
- a pressure sensitive MEMS structure disposed over the semiconductor substrate and including a suspended structure in a cavity;
- and
- an acoustic port through the semiconductor substrate establishing an open conduit suitable to allow acoustic pressure to deflect the suspended structure.
Dependencies are inferred from the claim text.