Battery packs and methods for manufacturing battery packs
AssigneeBlack & Decker Inc.
InventorsMichael VARIPATIS, Nathan J. OSBORNE, Alfred M. IRUNGU, Ryan KLEE, Nicholas J. GARIBALDI, William T. LUNSFORD, V, Nathan J. CRUISE
Life of this patent
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Abstract
The present disclosure is directed to a battery pack including a printed circuit board populated with a variety of components. The printed circuit board is partially encapsulated with a low pressure molded material to form at least a portion of a potting boat. The potting boat is filled with an encapsulating material.
Claims14
An encapsulated printed circuit board, comprising:
- a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
- a low pressure molded material applied to at least a portion of the perimeter wall such that a portion of the low pressure molded material extends generally perpendicularly to the top side to create a potting wall extending from the top side at the at least a portion of the perimeter wall and generally parallel to the perimeter wall.
An encapsulated printed circuit board, comprising:
- a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
- a low pressure molded material molded about a majority of the bottom side and at least a portion of the perimeter wall such that a potting wall extends generally perpendicularly to the top side and generally parallel to the perimeter wall at the at least a portion of the perimeter wall.
A method of encapsulating a printed circuit board, comprising the steps of:
- providing a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
- populating the printed circuit board with a plurality of electronic components;
- applying a low pressure molded material to at least a portion of the perimeter wall such that a portion of the low pressure molded material extends generally perpendicularly to the top side thereby creating a potting wall extending from the top side at the at least a portion of the perimeter wall and generally parallel to the perimeter wall.
A method of encapsulating a printed circuit board, comprising the steps of:
- providing a printed circuit board having a top side, a bottom side and a perimeter wall coupling the top side and the bottom side;
- populating the printed circuit board with a plurality of electronic components;
- molding a low pressure molded material about a majority of the bottom side and at least a portion of the perimeter wall to form a potting wall that extends generally perpendicularly to the top side and generally parallel to the perimeter wall at the at least a portion of the perimeter wall.
Dependencies are inferred from the claim text.