Multi header for thermoelectric device

A method of manufacturing a thermoelectric device comprising:

• providing a plurality of thermoelectric legs;
• thermally attaching a cold header to the plurality of thermoelectric legs;
• and
• thermally attaching a hot header to the plurality of thermoelectric legs opposite the cold header;
• where at least one of the cold header and the hot header includes at least one score line.

A heat pump, comprising:

• a surround and spacer (SAS) structure comprising a wall defining a first open side and a second open side;
• an interconnect board enclosed within the SAS structure, the interconnect board comprising one or more openings from a first surface of the interconnect board to a second surface of the interconnect board, the one or more openings defining locations at which at least one thermoelectric module is to be mounted on the interconnect board;
• the at least one thermoelectric module mounted on the interconnect board at the locations defined by the one or more openings, each thermoelectric module of the at least one thermoelectric module comprising:
• a plurality of thermoelectric legs;
• a cold header thermally attached to the plurality of thermoelectric legs;
• and
• a hot header thermally attached to the plurality of thermoelectric legs opposite the cold header;
• where at least one of the cold header and the hot header includes at least one score line;
• a hot-side heat spreader that is in thermal contact with the hot header of each thermoelectric module of the at least one thermoelectric module;
• and
• a cold-side heat spreader that is in thermal contact with the cold header of each thermoelectric module of the at least one thermoelectric module;
• wherein a periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and a periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that a compression force applied to the heat pump is absorbed by the SAS structure.