# US 2017/0365754 A1 · Light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0365754 A1 - Document ID: US20170365754A1 - Status: Published application - Kind: A1 - Application number: 15/534,297 - Filed: 2015-12-10 - Published: 2017-12-21 - Earliest claimed: 2014-12-11 - Assignees: Citizen Electronics Co., Ltd.; Citizen Watch Co., Ltd. - Applicants: Citizen Electronics Co., Ltd.; Citizen Watch Co., Ltd. - Inventors: Koichi Fukasawa; Nodoka Oyamada - Web page: https://patentgrep.com/patent/US20170365754A1 ## CPC - H10H 20/8515: {not being in contact with the bodies} - F21K 9/00: Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers - F21S 2/00: Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction - F21V 19/00: Fastening of light sources or lamp holders (fastening electric light source solely by the coupling device H01R33/00 {; special means for attaching candle to candle holder F21V35/003}) - F21V 23/00: Arrangement of electric circuit elements in or on lighting devices {(characterised by cooling arrangements F21V29/508)} - F21V 31/00: Gas-tight or water-tight arrangements - F21V 31/04: Provision of filling media - H10H 20/85: Packages - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8583: {not being in contact with the bodies} - H10W 90/00: Package configurations - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/753: {between laterally-adjacent chips} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A light-emitting device in which the emission intensity of light-emitting elements is improved by making heat generated by light emission of the light-emitting elements be effectively released is provided. The light-emitting device includes a mounting substrate including a mounting region, light-emitting elements mounted on the mounting region, a sealing resin which contains a phosphor and integrally seals the light-emitting elements, and at least one heat transfer member which is arranged among the light-emitting elements on the mounting region, is embedded in the sealing resin, and has a higher thermal conductivity than the sealing resin. ## Claims ### Claim 1 A light-emitting device comprising: a mounting substrate including a mounting region; light-emitting elements mounted on the mounting region; a sealing resin which contains a phosphor and integrally seals the light-emitting elements; and at least one heat transfer member which is arranged among the light-emitting elements on the mounting region, is embedded in the sealing resin, and has a higher thermal conductivity than the sealing resin. ### Claim 2 (depends on 1) The light-emitting device according to claim 1, wherein the light-emitting elements are arranged in a lattice pattern on the mounting region, and the at least one heat transfer member comprises a plurality of heat transfer members which are columnar members respectively arranged in lattices configured by the light-emitting elements. ### Claim 3 (depends on 1) The light-emitting device according to claim 1, wherein a lower end of the heat transfer member is embedded in the mounting substrate. ### Claim 4 (depends on 1) The light-emitting device according to claim 1, further comprising wires for electrically connecting the light-emitting elements to one another in the sealing resin, wherein the heat transfer member is made of a material harder than the sealing resin, and includes an upper end located at a position higher than upper ends of the wires. ### Claim 5 (depends on 1) The light-emitting device according to claim 1, wherein the light-emitting elements are mounted on the mounting region through bumps, respectively, and the heat transfer member is made of a material harder than the sealing resin, and includes an upper end located at a position higher than an upper surface of any of the light-emitting elements. ### Claim 6 (depends on 4) The light-emitting device according to claim 4, wherein the heat transfer member is made of a metal material. ### Claim 7 (depends on 4) The light-emitting device according to claim 4, wherein the heat transfer member is made of a material having translucency or light diffusivity, and contains a phosphor. ### Claim 8 (depends on 1) The light-emitting device according to claim 1, wherein the heat transfer member includes a fence-like circumferential surface surrounding a periphery of the light-emitting elements. ### Claim 9 (depends on 8) The light-emitting device according to claim 8, wherein a reflecting surface is provided on the circumferential surface of the heat transfer member. ### Claim 10 (depends on 8) The light-emitting device according to claim 8, further comprising wires for electrically connecting the light-emitting elements to one another in the sealing resin, wherein the heat transfer member is made of a material harder than the sealing resin, and includes an upper end located at a position higher than upper ends of the wires, and a notch for passing the wires is partially provided on the upper end of the heat transfer member. ### Claim 11 (depends on 1) The light-emitting device according to claim 1, wherein the sealing resin includes a first layer and a second layer in which a concentration of the phosphor is different from each other, in this order from a side near the mounting substrate, and the concentration of the phosphor in the first layer is higher than the concentration of the phosphor in the second layer.