Semiconductor light emitting device package

A semiconductor light emitting device package comprising:

• a light emitting structure having a sequentially layered structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, and having a first surface comprising a surface of the first conductive semiconductor layer, and a second surface opposite the first surface;
• a first electrode and a second electrode disposed on the second surface of the light emitting structure, and connected to the first conductive semiconductor layer and the second conductive semiconductor layer, respectively;
• an insulating layer at least partially covering the second surface of the light emitting structure, the first electrode, and the second electrode;
• a first bonding structure and a second bonding structure disposed on the insulating layer, the first bonding structure being electrically connected to the first electrode and second bonding structure being electrically connected to the second electrode and each of the first bonding structure and the second bonding structure having a patterned surface with a surface roughness of at least one of 0.05 μm or more as an arithmetic mean roughness (Ra) or of 0.5 μm or more as a 10-point average roughness (Rz);
• and
• an encapsulant in contact with the patterned surfaces of the first bonding structure and the second bonding structure.

A semiconductor light emitting device package comprising:

• a light emitting diode structure having opposite first and second surfaces, and comprising first and second semiconductor layers with an active layer there between;
• a first electrode and a second electrode contacting the second surface of the light emitting diode structure, and electrically connected to the first semiconductor layer and the second semiconductor layer, respectively;
• an insulating layer at least partially covering the second surface of the light emitting structure, the first electrode, and the second electrode;
• first and second metal connectors disposed on the insulating layer, and connected, respectively to the first and second electrodes, and each having at least one rough surface;
• and
• an encapsulant disposed to surround the first and second metal connectors,
• wherein the rough surfaces of the first and second metal connectors increase a surface area of an interface between the metal connectors and the encapsulant thereby increasing adhesion there-between.