Semiconductor device, power supply circuit, and computer
AssigneeKabushiki Kaisha Toshiba
InventorsShintaro NAKANO, Tatsuo SHIMIZU
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AssigneeKabushiki Kaisha Toshiba
InventorsShintaro NAKANO, Tatsuo SHIMIZU
Estimating the term…
A semiconductor device of an embodiment includes a first nitride semiconductor layer, a second nitride semiconductor layer located on the first nitride semiconductor layer and having a larger bandgap than the first nitride semiconductor layer, a first electrode on the second nitride semiconductor layer, a second electrode on the second nitride semiconductor layer, a gate electrode located between the first electrode and the second electrode, and a first insulating layer located at least between the gate electrode and the second electrode on the second nitride semiconductor layer, the first insulating layer being an oxide of at least one first element selected from the group consisting of Hf, Zr, and Ti, and containing 5×1019 cm−3 or more of at least one second element selected from the group consisting of F, H, D, V, Nb, and Ta, and 5×1019 cm−3 or more of at least one third element selected from the group consisting of N, P, As, Sb, Bi, Be, Mg, Ca, Sr, Ba, Sc, Y, and lanthanoids.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.