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US 2017/0365633 A1Published application
Solid-state image sensor and electronic device
AssigneeSony Corporation
InventorsShinji Miyazawa, Yutaka Ooka
Life of this patent
Estimating the term…
Abstract
There is provided a solid-state imaging device including a substrate having a surface over which a plurality of photodiodes are formed, and a protection film that is transparent, has a water-proofing property, and includes a side wall part vertical to the surface of the substrate and a ceiling part covering a region surrounded by the side wall part, the side wall part and the ceiling part surrounding a region where the plurality of photodiodes are arranged over the substrate.
Claims31
1-20. (canceled)
A package comprising:
- a glass substrate;
- a semiconductor substrate having a first side as a light-incident side and a second side opposite to the first side;
- a protection layer between the glass substrate and the first side of the semiconductor substrate;
- a microlens layer at the first side of the semiconductor substrate;
- a first resin region including resin material between the protection layer and the glass substrate;
- and
- a second resin region including resin material between a plane that is coincident with the first side of the semiconductor substrate and a plane that is coincident with the second side of the semiconductor substrate.
4 more elements
A package comprising:
- a glass substrate;
- a substrate having a first side as a light-incident side and a second side opposite to the first side;
- a protection layer between the glass substrate and the first side of the substrate;
- a microlens layer at the first side of the substrate;
- a first resin region including resin material between the protection layer and the glass substrate;
- and
- a second resin region including resin material between an edge of the substrate and an edge of the package, wherein the second resin region extends beyond an edge of the protection layer in a direction parallel to the first side of the substrate.
4 more elements
A camera module comprising:
- a package including:
- a glass substrate,
- a semiconductor substrate having a first side as a light-incident side and a second side opposite to the first side,
- a protection layer between the glass substrate and the first side of the semiconductor substrate,
- a microlens layer over a color filter,
- a first resin region including resin material between the protection layer and the glass substrate,
- a second resin region including resin material between a plane that is coincident with the first side of the semiconductor substrate and a plane that is coincident with the second side of the semiconductor substrate;
- at least one lens that guides light to the light-incident side of the semiconductor substrate;
- and
- a signal processing circuit that processes an output signal from the package.
7 more elements
A camera module comprising:
- a package including:
- a glass substrate,
- a substrate having a first side as a light-incident side and a second side opposite to the first side,
- a protection layer between the glass substrate and the first side of the substrate,
- a microlens layer over a color filter,
- a first resin region including resin material between the protection layer and the glass substrate, and
- a second resin region including resin material between an edge of the substrate and an edge of the package, wherein the second resin region extends beyond an edge of the protection layer in a direction parallel to the first side of the substrate;
- at least one lens that guides light to the light-incident side of the substrate;
- and
- a signal processing circuit that processes an output signal from the package.
7 more elements
Dependencies are inferred from the claim text.