Optical package structure
AssigneeKingpak Technology Inc.
InventorsHsiu Wen TU, Chung-Hsien Hsin, Jina-Ru Chen
Life of this patent
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Abstract
An optical package structure is provided. The optical package structure includes a substrate, a frame layer, an optical unit, a bonding layer, a transparent plate and an encapsulation layer. The frame layer formed on the substrate surrounds a cavity where the optical unit is located. The bonding layer covers a portion of an upper edge of the frame layer and exposes the other portion of the upper edge of the frame layer. The transparent plate mounted on the bonding layer extends across the optical unit and extends beyond an outer edge of the bonding layer. The encapsulation layer covers a lateral edge of the transparent plate and the outer edge of the bonding layer.
Claims17
An optical package structure comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a frame layer formed on the first surface of the substrate and surrounding a cavity on the substrate;
- an optical unit disposed on the first surface of the substrate and located inside the cavity;
- a bonding layer formed on a portion of an upper edge of the frame layer and exposing the other portion of the upper edge of the frame layer;
- a transparent plate mounted on the bonding layer and extending across the optical unit, the transparent plate extending beyond an outer edge of the bonding layer, the transparent plate having a first surface and a second surface opposite to the first surface and facing toward the optical unit;
- and
- an encapsulation layer covering a lateral edge of the transparent plate and the outer edge of the bonding layer, and partially covering the second surface of the transparent plate and the upper edge of the frame layer.
An optical package structure comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a frame layer formed on the first surface of the substrate and surrounding a cavity on the substrate;
- an optical unit disposed on the first surface of the substrate and located inside the cavity;
- at least one wire electrically connected to the optical unit;
- a transparent plate mounted on the frame layer and covering the cavity;
- and
- an encapsulation layer covering a lateral edge of the transparent plate and the outer edge of the frame layer,
- wherein a plurality of through holes are provided in the substrate and connecting the first surface and the second surface of the substrate, openings of the through holes on the first surface of the substrate being located under the optical unit, the frame layer or the encapsulation layer, a protection film being formed between the openings of the through holes and the optical unit, the frame layer or the encapsulation layer, the wire being electrically connected to the through holes.
Dependencies are inferred from the claim text.