Method of producing component board
AssigneeSharp Kabushiki Kaisha
InventorMASAKI FUJIWARA
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Abstract
A method of producing a CF board and an array board includes: a separation film forming process for forming resin substrates on the separation films; a thin film component forming process for forming TFTs and color filters that axe thin film components on the resin removals of fee resin substrates; a determining process for determining whether levels of adhesion between the separation films and the resin substrates are high or low based on image data obtained through capturing of images of the separation films, and a removing process for removing the resin substrates from the supporting substrates if the levels of adhesion are determined low in the determining process.
Claims8
A method of producing a component board comprising:
- a separation film forming process for forming a separation film on a supporting substrate;
- a component support forming process for forming a component support for forming a component support on the separation film;
- a thin film component forming process for forming a thin film component on the component support;
- a light applying process for applying light to the separation film for accelerating a removal of the component support;
- a determining process for determining whether a degree of adhesion between the separation film and the component support is high or low based on image data obtained through capturing of an image of the separation film;
- and
- a removing process for removing the component support from the supporting substrate if the degree of adhesion is determined low in the determining process.
Dependencies are inferred from the claim text.