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US 2017/0365582 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsGwang Sun Seo, Myung Sung Kang, Won Keun Kim, Jin Woo Park, Yong Won Choi
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Abstract
A semiconductor package includes a substrate, a plurality of semiconductor chips stacked on the substrate, and a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips. The plurality of bonding layers may be divided into a plurality of groups, each having different physical properties depending on a distance from the substrate.
Claims23
A semiconductor package, comprising:
- a substrate;
- a plurality of semiconductor chips stacked on the substrate;
- and
- a plurality of bonding layers bonded to lower surfaces of the plurality of semiconductor chips,
- wherein the plurality of bonding layers are divided into a plurality of groups, each group having different physical properties depending on a distance from the substrate.
2 more elements
A semiconductor package, comprising:
- a substrate;
- and
- a plurality of semiconductor chips stacked on the substrate through bonding layers, each bonding layer having different physical properties chosen from among:
- the thermal coefficient of expansion, the degree of curing shrinkage, and Young's modulus.
1 more element
-24. (canceled)
A semiconductor package, comprising:
- a substrate;
- semiconductor chips stacked on the substrate;
- through vias penetrating through the semiconductor chips;
- bumps disposed between the semiconductor chips and connected to the through vias;
- bonding layers disposed between the semiconductor chips, surrounding the bumps, and having different physical properties;
- and
- a molding portion surrounding the semiconductor chips and the bonding layers.
4 more elements
-32. (canceled)
-36. (canceled)
Dependencies are inferred from the claim text.